July 19, 2019
Technical Papers Published in 2010

"Full-Wave Simulation of an Electrostatic Discharge Generator Discharging in Air-Discharge Mode Into a Product ”
Liu, D.; Nandy, A.; Zhou, F.; Huang, W.; Xiao, J.; Seol, B.; Lee, J.; Fan, J.; Pommerenke, D.; Electromagnetic Compatibility, IEEE Transactions on Issue: 99 Digital Object Identifier: 10.1109/TEMC.2010.2087025 Publication Year: 2010 , Page(s): 1 - 2

 

"A Novel Impedance Definition of a Parallel Plate Pair for an Intrinsic Via Circuit Model”
Zhang, Y.-J.; Feng, G.; Fan, J.; Microwave Theory and Techniques, IEEE Transactions on Issue: 99 Digital Object Identifier: 10.1109/TMTT.2010.2083870 Publication Year: 2010 , Page(s): 3780 – 3789

 

"Signal/Power Integrity Analysis for Multilayer Printed Circuit Boards Using Cascaded S-Parameters”
De Paulis, F.; Yao-Jiang Zhang; Jun Fan; Electromagnetic Compatibility, IEEE Transactions on Volume: 52 , Issue: 4 Digital Object Identifier: 10.1109/TEMC.2010.2072784 Publication Year: 2010 , Page(s): 1008 - 1018

 

"An Intrinsic Circuit Model for Multiple Vias in an Irregular Plate Pair Through Rigorous Electromagnetic Analysis”
Yao-Jiang Zhang; Jun Fan; Microwave Theory and Techniques, IEEE Transactions on Volume: 58 , Issue: 8 Digital Object Identifier: 10.1109/TMTT.2010.2052956 Publication Year: 2010 , Page(s): 2251 - 2265

 

"Systematic Microwave Network Analysis for Multilayer Printed Circuit Boards with Vias and Decoupling Capacitors”
Yao-Jiang Zhang; Zaw Zaw Oo; Xing-Chang Wei; En-Xiao Liu; Jun Fan; Er-Ping Li; Electromagnetic Compatibility, IEEE Transactions on Volume: 52 , Issue: 2 Digital Object Identifier: 10.1109/TEMC.2010.2040389 Publication Year: 2010 , Page(s): 401 - 409

 

"Complex Permittivity and Permeability Measurements and Finite-Difference Time-Domain Simulation of Ferrite Materials”
Jianfeng Xu; Koledintseva, M.Y.; Yaojiang Zhang; Yongxue He; Matlin, B.; DuBroff, R.E.; Drewniak, J.L.; Jianmin Zhang; Electromagnetic Compatibility, IEEE Transactions on Volume: 52 , Issue: 4 Digital Object Identifier: 10.1109/TEMC.2010.2050693 Publication Year: 2010 , Page(s): 878 - 887

 

"A Rapid-Acquisition Electrical Time-Domain Reflectometer for Dynamic Structure Analysis”
Bishop, J. A.; Pommerenke, D. J.; Chen, G.; Instrumentation and Measurement, IEEE Transactions on Volume: PP , Issue: 99 Digital Object Identifier: 10.1109/TIM.2010.2058551 Publication Year: 2010 , Page(s): 1 - 7

 

"Frequency-Domain Probe Characterization and Compensation Using Reciprocity”
Weng, H.; Beetner, D. G.; DuBroff, R. E.; Electromagnetic Compatibility, IEEE Transactions on Volume: PP , Issue: 99 Digital Object Identifier: 10.1109/TEMC.2010.2059030 Publication Year: 2010 , Page(s): 1 - 9

 

"Analysis of mutual inductance effect between decoupling capacitors on planar power bus”
Bishop, J. A.; Pommerenke, D. J.; Chen, G.; Instrumentation and Measurement, IEEE Transactions on Volume: PP , Issue: 99 Digital Object Identifier: 10.1109/TIM.2010.2058551 Publication Year: 2010 , Page(s): 1 - 7

 

"Modeling of noise coupling inside multilayer printed circuit boards using cavity model and segmentation technique”
Zhenwei Yu; Jun Fan; Connor, S.; Archambeault, B.; Drewniak, J.L.; Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on Digital Object Identifier: 10.1109/APEMC.2010.5475649 Publication Year: 2010 , Page(s): 321 - 324

 

"Effects of TVS integration on system level ESD robustness”
Wei Huang; Dunnihoo, J.; Pommerenke, D.; Electrical Overstress/ Electrostatic Discharge Symposium (EOS/ESD), 2010 32nd Digital Object Identifier: 10.1109/APEMC.2010.5475649 Publication Year: 2010 , Page(s): 1 - 6

 

"Measuring IC switching current waveforms using a GMI probe for power integrity studies”
Fan Zhou; Songping Wu; Pommerenke, D.; Kayano, Y.; Inoue, H.; Tan, K.; Jun Fan; Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on Digital Object Identifier: 10.1109/APEMC.2010.5475607 Publication Year: 2010 , Page(s): 317 - 320

 

"Measurement methodology for establishing an IC ESD sensitivity database”
Zhen Li; Jiang Xiao; Byongsu Seol; Jongsung Lee; Pommerenke, D.; Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on Digital Object Identifier: 10.1109/APEMC.2010.5475629 Publication Year: 2010 , Page(s): 1051 - 1054

 

"Probe characterization and data process for current reconstruction by near field scanning method”
Wei Huang; Dazhao Liu; Jiang Xiao; Pommerenke, D.; Jin Min; Muchaidze, G.; Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on Digital Object Identifier: 10.1109/APEMC.2010.5475504 Publication Year: 2010 , Page(s): 467 - 470

 

"Near field probe for detecting resonances in EMC application”
Jiang Xiao; Dazhao Liu; Pommerenke, D.; Wei Huang; Peng Shao; Xiang Li; Jin Min; Muchaidze, G.; Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on Digital Object Identifier: 10.1109/APEMC.2010.5475739 Publication Year: 2010 , Page(s): 243 - 246

 

"FDTD modeling of absorbing materials for EMI applications”
Xu, J.; Koledintseva, M.Y.; Soumya De; Radchenko, A.; DuBroff, R.E.; Drewniak, J.L.; Yongxue He; Johnson, R.; Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on Digital Object Identifier: 10.1109/APEMC.2010.5475680 Publication Year: 2010 , Page(s): 173 - 176

 

"Differential extrapolation method for separating dielectric and rough conductor losses in printed circuit boards”
A. Koul, M.Y. Koledintseva, J.L. Drewniak, and S. Hinaga; IEEE Trans. Electromag. Compat. , Feb. 2011

 

"Systematic analysis and engineering of absorbing materials containing magnetic inclusions for EMC applications”
M. Koledintseva, J. Xu, S. De, J.L. Drewniak, Y. He, and R. Johnson; IEEE Trans. Magnetics, 2011

 

"Planar transmission line method for characterization of printed circuit board dielectrics”
J. Zhang, M. Koledintseva, G. Antonini, J. Drewniak, A. Orlandi, and K. Rozanov; Progress In Electromagnetic Research, PIER, Vol. 102, March 2010, pp. 267-286

 

"Causal RLGC(f) models of transmission lines based on measured S-parameters”
J. Zhang, J.L.Drewniak, D.J.Pommerenke, M.Y.Koledintseva, R.E.DuBroff, W. Cheng, Z. Yang, Q.B.Chen, and A.Orlandi; IEEE Trans. Electromag. Compat. Vol. 52, no. 1, Publication Year: 2010 , Page(s): 189-198.

 

"Experiment-based separation of conductor loss from dielectric loss in PCB striplines”
M. Koledintseva, J. Drewniak, S. Hinaga, F. Zhou, A. Koul, and A. Gafarov; DesignCon 2011, Santa Clara, CA

 

"A new mixing rule for predicting frequency-dependent material parameters of composites”
K. N. Rozanov, M.Y. Koledintseva, and J.L. Drewniak; URSI-B Symposium on Electromagnetic Theory (EMTS), Berlin, Germany, August 16-20, 2010,Vol. 52, no. 1, Publication Year: 2010 , Page(s): 646-649.

 

"Modeling of electromagnetic wave propagation in printed circuit board striplines with rough conductors”
M.Y. Koledintseva, M. Wang, S. Shen, J. Chen, A. Koul, and J.L. Drewniak; Abstracts, Progress In Electromagnetic Research Symposium PIERS 2010, Cambridge, MA, July 4-7, Publication Year: 2010 , Page(s): 462.

 

"A new mixing rule for frequency dependence of permeability in composites”
K.N. Rozanov, M.Y. Koledintseva, and J. L. Drewniak; Abstracts, Progress In Electromagnetic Research Symposium PIERS 2010, Cambridge, MA, July 4-7, Publication Year: 2010 , Page(s): 132.

 

"Effective electromagnetic parameters of composites containing magnetic platelets”
M.Y. Koledintseva, J.L. Drewniak, and K.N. Rozanov; Abstracts, Progress In Electromagnetic Research Symposium PIERS 2010, Cambridge, MA, July 4-7, Publication Year: 2010 , Page(s): 133.

 

"Predicting of wideband electromagnetic responses of composites containing magnetic inclusions”
K.N. Rozanov, M.Y. Koledintseva, and J. L. Drewniak; IEEE Symp. Electromag. Compat., July 25-30, Fort Lauderdale, FL, 2010, July 25-30, Publication Year: 2010 , Page(s): 857-862.

 

"Lumped-element circuit model of ferrite chokes”
A. Orlando, M.Y. Koledintseva, D.G. Beetner, P. Shao, and P.H. Berger; IEEE Symp. Electromag. Compat., July 25-30, Fort Lauderdale, FL, July 25-30, 2010, Publication Year: 2010 , Page(s): 754-759.

 

"Surface impedance approach to calculate loss in rough conductor coated with dielectric layer”
M. Koledintseva, A. Koul, F. Zhou, J. Drewniak, and S. Hinaga; IEEE Symp. Electromag. Compat., July 25-30, Fort Lauderdale, FL, July 25-30, 2010, Publication Year: 2010 , Page(s): 790-795.

 

"Evaluation of propagation characteristics for PCB traces with periodic roughness using ASM-FDTD method”
M. Wang, R. Qiang, J. Chen, M. Koledintseva, A. Koul, and J. Drewniak; IEEE Symp. Electromag. Compat., July 25-30, Fort Lauderdale, FL, July 25-30, 2010, Publication Year: 2010 , Page(s): 269-273.

 

"Thermal effects on PCB laminate material dielectric constant and dissipation factor”
S. Hinaga, M. Koledintseva, J. Drewniak, A. Koul, and F. Zhou; Techn. Conf. IPC Expo/APEX 2010, Las Vegas, April 5-8, 2010, Publication Year: 2010 , paper # S16-1 (Academic Poster Award).

 

"A systematic approach to PCB material characterization using time domain TRL calibration”
V. Khilkevich, M. Koledintseva, V. Sivarajan, D. Liu, B. Achkir, H. Ning, and J. Drewniak; DesignCon, 2010, Publication Year: 2010 , paper 5-TP1, pp. 1-17.

 

"Systematic analysis and engineering of absorbing materials containing ferrite or magnetic alloy inclusions for EMC applications”
M. Koledintseva, J. Xu, J. Drewniak, Y. He, and R. Johnson; Abstracts, Int. Conf on Microwave Magnetics ICMM-2010, Boston, June 1-4, 2010, Publication Year: 2010 , paper 5-TP1, p. 99.

 

"Attenuation in extended structures coated with thin magneto-dielectric absorber layer”
M. Koledintseva, Ji Zhang, Jianfeng Xu, J. Drewniak, and T. Tsutaoka; Abstracts, URSI Asia-Pacific RASC-2010, Toyama, Japan, Sept. 22-26, 2010, Publication Year: 2010 , paper E4-1.

 

"Microstructural and microwave absorption properties of Ba(1-x)SrxFe12o19 sintered hexaferrites”
C. Singh, B. Narang, I.S. Hudiara, M.Y. Koledintseva, and A.A. Kitaitsev; Abstracts, URSI Symposium AP-RASC-2010, Toyama, Japan, Sept. 22-26, 2010, Publication Year: 2010 , paper E4-3.

 

"Microstructural and Microwave Absorption Properties of Ba(1-x)Sr(x)Fe(12)O(19) Sintered Hexaferrites”
C. Singh, S.B. Narang, I.S. Hudiara, M.Y. Koledintseva, and A.A. Kitaitsev; Young Scientist Award Papers of 2010 URSI Asia-Pacific Radio Science Conference, Sept. 20-26, 2010, Toyama, Japan, Publication Year: 2010 , paper Y0010.

 

"Design and Modeling for Chip-to-Chip Communication at 20 Gbps”
Jianmin Zhang, Qinghua B. Chen, Kelvin Qiu, Antonio C. Scogna, Martin Schauer, Gerardo Romo, James L. Drewniak; Antonio Orlandi, Electromagnetic Compatibility, 2010. EMC 2010. IEEE International Symposium on, Publication Year: 2010 , pp. 467-472, 25-30.

 

"DC Blocking Via Structure Optimization and Measurement Correlation for SerDes Channels”
Jianmin Zhang, Qinghua B. Chen, Jun Fan, James L. Drewniak, Antonio Orlandi, Bruce Archambeault; Electromagnetic Compatibility, 2010. EMC 2010. IEEE International Symposium on, Publication Year: 2010 , pp. 557-562, 25-30.

 

"Stressed Jitter Analysis for Physical Link Characterization”
Nitin Radhakrishnan, Brice Achkir, Jun Fan, James L. Drewniak; Electromagnetic Compatibility, 2010. EMC 2010. IEEE International Symposium on, Publication Year: 2010 , pp. 568-572, 25-30.

 

"Surface Impedance Approach to Calculate Loss in Rough Conductor Coated with Dielectric Layer”
Marina Koledintseva, Amendra Koul, Fan Zhou, James Drewniak, and Scott Hinaga; Electromagnetic Compatibility, 2010. EMC 2010. IEEE International Symposium on, Publication Year: 2010 , pp. 790-795, 25-30.

 

"Predicting of Wideband Electromagnetic Responses of Composites Containing Magnetic Inclusions”
Konstantin N. Rozanov, Marina Y. Koledintseva, and James Drewniak; Electromagnetic Compatibility, 2010. EMC 2010. IEEE International Symposium on, Vol., no., Publication Year: 2010 , pp. 857-862, 25-30.

 

"Investigation of Noise Coupling from Switching Power Supply to Signal Nets”
Songping Wu, Keong Kam, David Pommerenke, Bill Cornelius, Hao Shi, Matthew Herndon, and Jun Fan; Electromagnetic Compatibility, 2010. EMC 2010. IEEE International Symposium on, Publication Year: 2010 , pp. 79-84, 25-30.

 

"Extracting Physical IC Models Using Near-Field Scanning”
Zhenwei Yu, Jayong Koo, Jason A Mix, Kevin Slattery, and Jun Fan; Electromagnetic Compatibility, 2010. EMC 2010. IEEE International Symposium on, Publication Year: 2010 , pp. 317-, 25-30.

 

"Improvements in GMI Probe Design for Time-Domain Transient Current Measurements”
Fan Zhou, Songping Wu, David Pommerenke,Yoshiki Kayano, Hiroshi Inoue, Kenji Tan, and Jun Fan; Electromagnetic Compatibility, 2010. EMC 2010. IEEE International Symposium on, Publication Year: 2010 , pp. 340-343, 25-30.

 

"Hybrid Method Used to Model Via Transitions”
Hanfeng Wang, Albert E. Ruehli, Jun Fan; Electromagnetic Compatibility, 2010. EMC 2010. IEEE International Symposium on, Publication Year: 2010 , pp. 401-406, 25-30.

 

"Improved Target Impedance and IC Transient Current Measurement for Power Distribution Network Design”
Jingook Kim, Songping Wu, Hanfeng Wang, Yuzou Takita,Hayato Takeuchi, Kenji Araki, Gang Feng, and, Jun Fan; Electromagnetic Compatibility, 2010. EMC 2010. IEEE International Symposium on, Publication Year: 2010 , pp. 445-450, 25-30.

 

"Analyzing Via Impedance Variations with a Stochastic Collation Method”
Jianxiang Shen, Hanfeng Wang, Ji Chen, and Jun Fan; Electromagnetic Compatibility, 2010. EMC 2010. IEEE International Symposium on, Publication Year: 2010 , pp. 552-556, 25-30.

 

"Equivalent Transmission-Line Model for Vias Connected to Striplines in Multilayer Print Circuit Boards”
Siming Pan, Jianmin Zhang, Qinghua B. Chen, and, Jun Fan; Electromagnetic Compatibility, 2010. EMC 2010. IEEE International Symposium on, Publication Year: 2010 , pp. 455-460, 25-30.

 

"Enabling Terabit Per Second Switch Linecard Design Through Chip/Package/PCB Co-design”
Qinghua Bill Chen, Jianmin Zhang, Kelvin Qiu, Darja Padilla, Zhiping Yang Yang, Antonio C. Scogna, Jun Fan; Electromagnetic Compatibility, 2010. EMC 2010. IEEE International Symposium on, Publication Year: 2010 , pp. 585-590, 25-30.

 

"An Equivalent Three-Dipole Model for IC Radiated Emissions Based on TEM Cell Measurements”
Siming Pan, Jingook Kim, Sungnam Kim, Jaesu Park, Heoncheol Oh, and, Jun Fan; Electromagnetic Compatibility, 2010. EMC 2010. IEEE International Symposium on, Publication Year: 2010 , pp. 652-656, 25-30.

 

"Applying Feature Selective Validation (FSV) as an Objective Function for Data Optimization”
Siming Pan, Hanfeng Wang and Jun Fan; Electromagnetic Compatibility, 2010. EMC 2010. IEEE International Symposium on, Publication Year: 2010 , pp. 718-,721, 25-30.

 

"Modeling Connector Contact Condition Using a Contact Failure Model with Equivalent Inductance”
Yu-ichi Hayashi, Songping Wu, Jun Fan, Takaaki Mizuki, Hideaki Sone; Electromagnetic Compatibility, 2010. EMC 2010. IEEE International Symposium on, Publication Year: 2010 , pp. 743-747, 25-30.

 

"Equivalent Circuit Models for Evaluation of Bandgap Limits for Planar Electromagnetic Bandgap Structures”
Francesco de Paulis, Leo Raimondo, Antonio Orlandi, Liehui Ren, Jun Fan; Electromagnetic Compatibility, 2010. EMC 2010. IEEE International Symposium on, Publication Year: 2010 , pp. 770-775, 25-30.

 

"Efficient Mid-Frequency Plane Inductance Computation”
Fan Zhou, Albert E. Ruehli, Jun Fan; Electromagnetic Compatibility, 2010. EMC 2010. IEEE International Symposium on, Publication Year: 2010 , pp. 831-836, 25-30.

 

"Reduction of Noise in Near-Field Measurements”
Christopher Osterwise, Steven L. Grant, and Daryl Beetner; Electromagnetic Compatibility, 2010. EMC 2010. IEEE International Symposium on, Publication Year: 2010 , pp. 171-176, 25-30.

 

"Modeling of the Immunity of ICs to EFTs”
Ji Zhang, Jayong Koo, Daryl G Beetner, Richard Moseley, Scott Herrin and David Pommerenke; Electromagnetic Compatibility, 2010. EMC 2010. IEEE International Symposium on, Vol., no., Publication Year: 2010 , pp. 484-489, 25-30.

 

"Rapid Simulation of the Statistical Variation of Crosstalk in Cable Harness Bundles”
Xiang Li, Meilin Wu, Daryl Beetner, Todd Hubing; Electromagnetic Compatibility, 2010. EMC 2010. IEEE International Symposium on, Publication Year: 2010 , pp. 614-619, 25-30.

 

"A Lumped-Element Circuit Model of Ferrite Chokes”
Andrea Orlando, Marina Y. Koledintseva, Daryl G. Beetner, Peng Shao, and Phil Berger; Electromagnetic Compatibility, 2010. EMC 2010. IEEE International Symposium on, Vol., no., Publication Year: 2010 , pp. 754-759, 25-30.

 

"Field Injection Probes for Field Coupled Electrostatic Discharge Sensitivity Database of ICs”
Zhen Li, Jiang Xiao, Byongsu Seol, Jongsung Lee, David Pommerenke; Electromagnetic Compatibility, 2010. EMC 2010. IEEE International Symposium on, Publication Year: 2010 , pp. 329-333, 25-30.

 

"PCB Design”
D. Beetner; Fundamentals Tutorial for the IEEE EMC Symposium,July, 2010 Invited Speaker.

 

"Real-Time Detection of Radio Receivers Using Stimulated Emissions”
C. Stagner, C. Osterwise, D. Beetner, S. Grant; ALERT RICC 2010, NorthEastern University, Boston MA, Oct. 10, 2010. (Unrefereed paper).

 

"Detection of electronic explosive initiators using their unintended electromagnetic emissions”
D. Beetner; ALERT RICC 2010, NorthEastern University, Boston MA, Oct. 10, 2010 Invited Speaker.

 

"Improving electromagnetic compatibility performance of packages and SiP modules using a conformal shielding solution,"
Karim, N.; Jingkun Mao; Jun Fan, Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on , vol., no., pp.56,59, 12-16 April 2010

 

"Recent development of via models: Hybrid circuit and field analysis,"
Yao-Jiang Zhang; Jun Fan, Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2010 IEEE , vol., no., pp.1,4, 7-9 Dec. 2010

 

"A new mixing rule for predicting of frequency-dependent material parameters of composites,"
Rozanov, K.N.; Koledintseva, M.Y.; Drewniak, J.L., Electromagnetic Theory (EMTS), 2010 URSI International Symposium on , vol., no., pp.584,587, 16-19 Aug. 2010

 

"Physics-based via model development and verification,"
Jianmin Zhang; Chen, Q.B.; Zhiping Yang; Drewniak, J.L.; Orlandi, A., Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on , vol., no., pp.1043,1046, 12-16 April 2010

 

"Model for ESD LCD upset of a portable product,"
Jiang Xiao; Pommerenke, D.; Fan Zhou; Drewniak, J.L.; Shumiya, H.; Yamada, T.; Araki, K.,Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on , vol., no., pp.354,358, 25-30 July 2010

 

"Stub length prediction for back-drilled vias using a fast via tool,"
Jianmin Zhang; Chen, Q.B.; Hanfeng Wang; Jun Fan; Orlandi, A.; Drewniak, J.L., Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2010 IEEE , vol., no., pp.1,4, 7-9 Dec. 2010

 

"Signal Integrity Design for High-Speed Digital Circuits: Progress and Directions,"
Jun Fan; Xiaoning Ye; Jingook Kim; Archambeault, B.; Orlandi, A., Electromagnetic Compatibility, IEEE Transactions on , vol.52, no.2, pp.392,400, May 2010

 

"Analysis of Simultaneous Switching Noise Coupling in Multilayer Power/Ground Planes With Segmentation Method and Cavity Model,"
Gang Feng; Jun Fan, Electromagnetic Compatibility, IEEE Transactions on , vol.52, no.3, pp.699,711, Aug. 2010

 

"Physics-Based Inductance Extraction for Via Arrays in Parallel Planes for Power Distribution Network Design,"
Jingook Kim; Liehui Ren; Jun Fan, Microwave Theory and Techniques, IEEE Transactions on , vol.58, no.9, pp.2434,2447, Sept. 2010

 

"Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects,"
Er-Ping Li; Xing-Chang Wei; Cangellaris, A.C.; En-Xiao Liu; Yao-Jiang Zhang; D''Amore, M.; Joungho Kim; Sudo, T., Electromagnetic Compatibility, IEEE Transactions on , vol.52, no.2, pp.248,265, May 2010