October 13, 2019
Technical Papers Published in 2012
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Prediction of common-mode current reduction using ferrites in systems with cable harnesses Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on Date of Conference: 6-10 Aug. 2012 Author(s): Bondarenko, N. EMC Lab., Missouri Univ. of Sci. & Technol. (MS&T), Rolla, MO, USA Peng Shao ; Orlando, A. ; Koledintseva, M.Y. ; Beetner, D.G. ; Berger, P. Page(s): 80 - 84 paper1.pdf
Locating Noncooperative Radio Receivers Using Wideband Stimulated Emissions, Instrumentation and Measurement, IEEE Transactions on Author(s): Stagner, C. Missouri University of Science and Technology, Rolla, MO 65409 USA (e-mail: cbsfg8@mst.edu; daryl@mst.edu). Halligan, M. ; Osterwise, C. ; Beetner, D. G. ; Grant, S. L. Volume: PP , Issue: 99 Page(s): 1 - 8 Paper2.pdf
An Effective Method of Probe Calibration in Phase-Resolved Near-Field Scanning for EMI Application This paper appears in: Instrumentation and Measurement, IEEE Transactions on Author(s): Zhang, J. Electromagnetic Compatibility Laboratory, Missouri University of Science and Technology, Rolla, MO 65401 USA. Kam, K. W. ; Min, J. ; Khilkevich, V. V. ; Pommerenke, D. ; Fan, J. Volume: PP , Issue: 99 Page(s): 1 - 11 Paper3.pdf
An inductive probe for the measurement of common mode currents on differential traces This paper appears in: Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on Date of Conference: 6-10 Aug. 2012 Author(s): Khilkevich, V. Dept. of Electr. & Comput. Eng., Missouri Univ. of Sci. & Technol., Rolla, MO, USA Pommerenke, D. ; Li Gang ; Xu Shuai Page(s): 720 - 724 Product Type: Conference PublicationsPaper4.pdf
Heat-Sink Modeling and Design With Dipole Moments Representing IC Excitation This paper appears in: Electromagnetic Compatibility, IEEE Transactions on Author(s): Yu, Z. Z. Yu was with the Electromagnetic Compatibility Laboratory, Missouri University of Science and Technology, Rolla, MO 65401 USA. He is now with Intel Corporation, Hillsboro, OR 97124 USA (e-mail: zyn6f@mst.edu). Mix, J. A. ; Sajuyigbe, S. ; Slattery, K. P. ; Pommerenke, D. ; Fan, J. Volume: PP , Issue: 99 Page(s): 1 - 7 Product Type: Early Access ArticlesPaper5.pdf
Portable Real-Time Microwave Camera at 24 GHz This paper appears in: Antennas and Propagation, IEEE Transactions on Date of Publication: Feb. 2012 Author(s): Ghasr, M.T. Appl. Microwave Nondestructive Testing Lab. (amntl), Missouri Univ. of Sci. & Technol., Rolla, MO, USA Abou-Khousa, M.A. ; Kharkovsky, S. ; Zoughi, R. ; Pommerenke, D. Volume: 60 , Issue: 2 Page(s): 1114 - 1125 Product Type: Journals & MagazinesPaper6.pdf
On different methods to combine cable information into near-field data for far-field estimation Keong Kam; Radchenko, A.; Pommerenke, D. Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on Topic(s): Components, Circuits, Devices & Systems ; Fields, Waves & Electromagnetics Digital Object Identifier: 10.1109/ISEMC.2012.6351767 Publication Year: 2012 , Page(s): 294 - 300Paper7.pdf
A novel method for ESD soft error analysis on integrated circuits using a TEM cell Jongsung Lee; Jaedeok Lim; Byongsu Seol; Zhen Li; Pommerenke, D. Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2012 34th Topic(s): Communication, Networking & Broadcasting ; Components, Circuits, Devices & Systems ; Computing & Processing (Hardware/Software) ; Engineered Materials, Dielectrics & Plasmas ; Fields, Waves & Electromagnetics Publication Year: 2012 , Page(s): 1 - 6Paper8.pdf
An application of utilizing the system-efficient-ESD-design (SEED) concept to analyze an LED protection circuit of a cell phone This paper appears in: Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on Date of Conference: 6-10 Aug. 2012 Author(s): Tianqi Li EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO, USA Maeshima, J. ; Shumiya, H. ; Pommerenke, D.J. ; Yamada, T. ; Araki, K. Page(s): 346 - 350 Product Type: Conference PublicationsPaper9.pdf
Compact Ka-Band One-Port Vector Reflectometer Using a Wideband Electronically Controlled Phase Shifter Fallahpour, M.; Baumgartner, M.A.; Kothari, A.; Ghasr, M.T.; Pommerenke, D.; Zoughi, R. Instrumentation and Measurement, IEEE Transactions on Volume: 61 , Issue: 10 Topic(s): Components, Circuits, Devices & Systems ; Power, Energy, & Industry Applications Digital Object Identifier: 10.1109/TIM.2012.2196389 Publication Year: 2012 , Page(s): 2807 - 2816Paper10.pdf
An Effective Method of Probe Calibration in Phase-Resolved Near-Field Scanning for EMI Application Zhang, J.; Kam, K. W.; Min, J.; Khilkevich, V. V.; Pommerenke, D.; Fan, J. Instrumentation and Measurement, IEEE Transactions on Volume: PP , Issue: 99 Topic(s): Components, Circuits, Devices & Systems ; Power, Energy, & Industry Applications Digital Object Identifier: 10.1109/TIM.2012.2218678 Publication Year: 2012 , Page(s): 1 - 11Paper11.pdf
Numerical evaluation of Near-Field to Far-Field transformation robustness for EMC Radchenko, A.; Ji Zhang; Keong Kam; Pommerenke, D. Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on Topic(s): Components, Circuits, Devices & Systems ; Fields, Waves & Electromagnetics Digital Object Identifier: 10.1109/ISEMC.2012.6351692 Publication Year: 2012 , Page(s): 605 - 611Paper12.pdf
Simulation of automotive EMC emission test procedures based on cable bundle measurements Gonser, M.; Keller, C.; Hansen, J.; Khillkevich, V.; Radchenko, A.; Pommerenke, D.; Weigel, R. Microwave Symposium Digest (MTT), 2012 IEEE MTT-S International Topic(s): Fields, Waves & Electromagnetics ; Photonics & Electro-Optics Digital Object Identifier: 10.1109/MWSYM.2012.6259432 Publication Year: 2012 , Page(s): 1 - 3Paper13.pdf
From Maxwell Garnett to Debye Model for Electromagnetic Simulation of Composite Dielectrics—Part II: Random Cylindrical Inclusions. Electromagnetic Compatibility, IEEE Transactions on April 2012, Volume: 54 , Issue: 2 Page(s): 280 - 289 Product Type: Journals & MagazinesPaper14.pdf
Differential Extrapolation Method for Separating Dielectric and Rough Conductor Losses in Printed Circuit Boards, Electromagnetic Compatibility, IEEE Transactions on April 2012, Volume: 54 , Issue: 2 Page(s): 421 - 433 Product Type: Journals & MagazinesPaper15.pdf
A Hierarchy of Explicit Low-Dispersion FDTD Methods for Electrically Large Problems, Antennas and Propagation, IEEE Transactions on Dec. 2012, Smith, W.S. Comput. Earth Sci. (EES-16), Los Alamos Nat. Lab., Los Alamos, NM, USA Razmadze, A.; Xuan-Min Shao; Drewniak, J.L. Volume: 60 , Issue: 12 Page(s): 5787 - 5800, Journals & Magazinespaper16.pdf
Signal integrity: Efficient, physics-based via modeling: Integration of striplines, Electromagnetic Compatibility Magazine, IEEE, Summer 2012, Rimolo-Donadio, R. T.J. Watson Res. Center, IBM, Yorktown Heights, NY, USA Selli, G.; De Paulis, F.; Xiaoxiong Gu; Kwark, Y.H.; Drewniak, J.L.; Bruens, H.-D.; Schuster, C. Volume: 1 , Issue: 2 Page(s): 74 - 81 paper17.pdf
Analytical Transfer Functions Relating Power and Ground Voltage Fluctuations to Jitter at a Single-Ended Full-Swing Buffer, Chulsoon Hwang; Jingook Kim; Achkir, B.; Jun Fan, Components, Packaging and Manufacturing Technology, IEEE Transactions on , vol.3, no.1, pp.113,125, Jan. 2013paper18.pdf
Modeling and Application of Multi-Port TSV Networks in 3-D IC, Wei Yao; Siming Pan; Achkir, B.; Jun Fan; Lei He, Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on , vol.32, no.4, pp.487,496, April 2013paper19.pdf
Accuracy of Physics-Based Via Models for Simulation of Dense Via Arrays, Müller, S.; Xiaomin Duan; Kotzev, M.; Yao-Jiang Zhang; Jun Fan; Xiaoxiong Gu; Kwark, Y.H.; Rimolo-Donadio, R.; Brüns, H.-D.; Schuster, C., Electromagnetic Compatibility, IEEE Transactions on , vol.54, no.5, pp.1125,1136, Oct. 2012paper20.pdf
Heat-Sink Modeling and Design With Dipole Moments Representing IC Excitation, Zhenwei Yu; Mix, J.A.; Sajuyigbe, S.; Slattery, K.P.; Pommerenke, D.; Jun Fan, Electromagnetic Compatibility, IEEE Transactions on , vol.55, no.1, pp.168,174, Feb. 2013paper21.pdf
Closed-Form Expressions for the Maximum Transient Noise Voltage Caused by an IC Switching Current on a Power Distribution Network, Jingook Kim; Liang Li; Songping Wu; Hanfeng Wang; Takita, Y.; Takeuchi, H.; Araki, K.; Jun Fan; Drewniak, J.L., Electromagnetic Compatibility, IEEE Transactions on , vol.54, no.5, pp.1112,1124, Oct. 2012paper22.pdf
An Improved Dipole-Moment Model Based on Near-Field Scanning for Characterizing Near-Field Coupling and Far-Field Radiation From an IC, Zhenwei Yu; Mix, J.A.; Sajuyigbe, S.; Slattery, K.P.; Jun Fan, Electromagnetic Compatibility, IEEE Transactions on , vol.55, no.1, pp.97,108, Feb. 2013paper23.pdf
Characterization of Via Structures in Multilayer Printed Circuit Boards With an Equivalent Transmission-Line Model, Siming Pan; Jun Fan, Electromagnetic Compatibility, IEEE Transactions on , vol.54, no.5, pp.1077,1086, Oct. 2012paper24.pdf
An Effective Method of Probe Calibration in Phase-Resolved Near-Field Scanning for EMI Application, Instrumentation and Measurement, Ji Zhang; Kam, K.W.; Jin Min; Khilkevich, V.V.; Pommerenke, D.; Jun Fan, IEEE Transactions on , vol.62, no.3, pp.648,658, March 2013paper25.pdf
A Generalized Multiple Scattering Method for Dense Vias With Axially Anisotropic Modes in an Arbitrarily Shaped Plate Pair, Yao-Jiang Zhang; Jun Fan, Microwave Theory and Techniques, IEEE Transactions on , vol.60, no.7, pp.2035,2045, July 2012paper26.pdf
An Improved Multiple Scattering Method for Via Structures With Axially Isotropic Modes in an Irregular Plate Pair, Yao-Jiang Zhang ; Chada, A.R. ; Jun Fan, Electromagn. Compat., IEEE Transactions on , vol 54 ,no, 2, pp. 457 - 465, 2012.paper27.pdf
PCB conductor surface roughness as a layer with effective material parameters, Koledintseva, M.Y.; Razmadze, A.G.; Gafarov, A.Y.; Soumya De; Drewniak, J.L.; Hinaga, S., Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on , vol., no., pp.138,143, 6-10 Aug. 2012paper28.pdf
Fast admittance computation for TSV arrays, Dazhao Liu; Siming Pan; Achkir, B.; Jun Fan, Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on , vol., no., pp.28,33, 6-10 Aug. 2012paper29.pdf
EMI reduction evaluation with flexible absorbing materials and ferrite cores applied on cables, Jing Li; Yao-Jiang Zhang; Gafarov, A.; De, S.; Koledintseva, M.Y.; Marchand, J.; Hess, D.; Durant, T.; Nickerson, E.; Drewniak, J.L.; Jun Fan, Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on , vol., no., pp.646,651, 6-10 Aug. 2012paper30.pdf
Modeling and analysis of numerical wave tank based on the ALE algorithm, Zhu, Feng; Zhu, Wei-hua; Fan, Jun; Fang, Bo; Zhao, Kun, Modelling, Identification & Control (ICMIC), 2012 Proceedings of International Conference on , vol., no., pp.673,678, 24-26 June 2012paper31.pdf
Analytical representations for frequency dependences of microwave permeability, Rozanov, K.N.; Koledintseva, M.Y., Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on , vol., no., pp.422,427, 6-10 Aug. 2012paper32.pdf
Electromagnetic properties of metal granular composite materials for EMC applications, Tsutaoka, T.; Tsurunaga, A.; Kasagi, T.; Hatakeyama, K.; Koledintseva, M.Y., Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on , vol., no., pp.411,415, 6-10 Aug. 2012paper33.pdf
Estimate on the uncertainty of predicting radiated emission from near-field scan caused by insufficient or inaccurate near-field data: Evaluation of the needed step size, phase accuracy and the need for all surfaces in the Huygens' box, Sorensen, M.; Franek, O.; Pedersen, G.F.; Radchenko, A.; Keong Kam; Pommerenke, D., Electromagnetic Compatibility (EMC EUROPE), 2012 International Symposium on , vol., no., pp.1,6, 17-21 Sept. 2012paper34.pdf
Capacitance calculation of TSVs using an integral equation method based on partial capacitances, Hanfeng Wang; Yao-Jiang Zhang; Ruehli, A.; Jun Fan, Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on , vol., no., pp.117,120, 6-10 Aug. 20paper35.pdf
Semi-automatic copper foil surface roughness detection from PCB microsection images, Soumya De; Gafarov, A.; Koledintseva, M.Y.; Stanley, R.J.; Drewniak, J.L.; Hinaga, S., Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on , vol., no., pp.132,137, 6-10 Aug. 2012paper36.pdf
Modeling broadside coupled traces using equivalent per unit length (Eq PUL) RLGC model, Chada, A.R.; Songping Wu; Jun Fan; Drewniak, J.L.; Mutnury, B.; de Araujo, D.N., Electrical Performance of Electronic Packaging and Systems (EPEPS), 2012 IEEE 21st Conference on , vol., no., pp.339,342, 21-24 Oct. 2012paper37.pdf
Accurate and efficient computation of power plane pair inductance,Liang Li; Ruehli, A.E.; Jun Fan, Electrical Performance of Electronic Packaging and Systems (EPEPS), 2012 IEEE 21st Conference on , vol., no., pp.167,170, 21-24 Oct. 2012paper38.pdf
Studies of TEM mode assumption on via holes in via modelings,Yao-Jiang Zhang; Shenhui Jing; Jun Fan, Electromagnetic Compatibility (APEMC), 2012 Asia-Pacific Symposium on , vol., no., pp.605,608, 21-24 May 2012paper39.pdf
A hybrid stack-up of printed circuit board for high-speed networking systems, Jianmin Zhang; Scogna, A.C.; Jun Fan; Archambeault, B.; Drewniak, J.L.; Orlandi, A., Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on , vol., no., pp.554,559, 6-10 Aug. 2012paper40.pdf
Switching-current measurement for multiple ICs sharing a common power island structure, Liang Li; Chulsoon Hwang; Tao Wang; Takita, Y.; Takeuchi, H.; Araki, K.; Jun Fan, Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on , vol., no., pp.560,564, 6-10 Aug. 201paper41.pdf